JPH01160883U - - Google Patents
Info
- Publication number
- JPH01160883U JPH01160883U JP4884988U JP4884988U JPH01160883U JP H01160883 U JPH01160883 U JP H01160883U JP 4884988 U JP4884988 U JP 4884988U JP 4884988 U JP4884988 U JP 4884988U JP H01160883 U JPH01160883 U JP H01160883U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- circuit board
- printed circuit
- hole
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4884988U JPH01160883U (en]) | 1988-04-12 | 1988-04-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4884988U JPH01160883U (en]) | 1988-04-12 | 1988-04-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160883U true JPH01160883U (en]) | 1989-11-08 |
Family
ID=31274981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4884988U Pending JPH01160883U (en]) | 1988-04-12 | 1988-04-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160883U (en]) |
-
1988
- 1988-04-12 JP JP4884988U patent/JPH01160883U/ja active Pending